Novel Epoxy resin/Benzedine Polymer network Synthesis with Silicon Powder as Filler and Evaluation of Their Mechanical Strength and thermal stability.

Abstract

The synthesis of high thermally stable Tetra-di-glycidyl ether bisphenol-A TDGEBA 
Epoxy resin and  Benzidine (BZ)  have been synthesized from BZ and DGEBA by in 
situ polymerization technique to obtain Tetra-di-glycidyl ether bisphenol-A Benzidine  
TDGEBA/BZ with A purple color developed Epoxy resin and modified with various 
percentages of Silicon (SI) as a filer to obtain Tetra diglycidyl ether bisphenol-A 
Benzidine Silicon TDGEBA/BZ -SI, to yield novel epoxy based curing agents. The 
resultant novel epoxy-based polyamides were cured with triethylenetetramine TETA 
(hardener) % to obtain highly cross-linked thermosetting polymer. The physical 
properties of the resulting blends were characterized by by measuring the Impact 
Strength of (TDGEBA/ /BZ-SI increased more than 33% than the unmodified epoxy 
resin and the hardness is found to be higher than unmodified DGEBA Epoxy resin. 
Differential scanning calorimetry (DSC) and thermo gravimetric (TGA) analysis were 
also cured to assess the thermal behavior of the samples. DSC of the (TDGEBA/BZ 
Epoxy resin cured with TETA showed exothermic reactions and the glass transition 
temperature (Tg) shifted from 300˚C to 450˚C compared with unmodified DGEBA 
epoxy and the thermal stability of the TDGEBA/BZ-SI Epoxy resin modified increased 
with increasing of Silicon .Scanning Electron Microscopy (SEM) studied the 
morphology of the samples after un notched impacts on fracture surfaces. These 
materials exhibited a higher degree of solvent resistance. . These materials exhibited a 
higher degree of solvent resistance. 
Keywords :Epoxy resin .  thermal stability . DSC . TGA . SEM